Wafer Scrubber
TSC-300S
This series comprises special cleaning equipment for wafers after CMP, with a single-station single-chamber design. These machines can integrate PVA scrubbing, mega-sonic cleaning, N2 blow drying, high-speed spin drying, and other functions with a high degree of integration, and are suitable for cleaning various semiconductor wafers after CMP.
璇ョ郴鍒椾负 CMP 鍚庢櫠鍦嗘彁渚涗笓鐢ㄦ竻娲楄澶囷紝閲囩敤鍗曞伐浣嶅崟瀹よ璁°€傝繖浜涜澶囧彲闆嗘垚 PVA 鎿︽礂銆佽秴澹版尝娓呮礂銆佹爱姘斿惞骞层€侀珮閫熻劚姘村共鐕ョ瓑楂樺害闆嗘垚鍔熻兘锛岄€傜敤浜 CMP 鍚庢竻娲楀悇绫诲崐瀵间綋鏅跺渾銆侟/span>
Cleaning StationSingle-lumen single station