Product Center
Application
Technology And Services
About TSD
Contact Us
涓枃
Grinder
Single-Side Polisher
Double-Side Polisher
Chemical Mechanical Polisher
Wax Bonder / Wafer Scrubber
棣栭〉
浜у搧涓績
Grinder
Single-Side Polisher
Double-Side Polisher
Chemical Mechanical Polisher
Wax Bonder / Wafer Scrubber
搴旂敤棰嗗煙
鎶€鏈笌鏈嶅姟
鍏充簬鐗规€濊开
鏂伴椈璧勮
鑱旂郴鎴戜滑
Chemical Mechanical Polisher
TMP-200S
TMP-200S
Diameter of Plates
530 mm
Product Consultation
Features
Pressurizing method
Airbag pressure
Drive mode
Polishing head is rotates and swings at meantime
Convenient processing
The semi-automatic wafer loading and unloading system can be configured
Good compatibility
Compatible with 6-12 inch wafers
Constant temperature control
Temperature control system for polishing plate
Control system
PC program
Submit
Submitted successfully
We will contact you as soon as possible.
Submission failed
Please refresh the page and resubmit.